Optical Inspection of Boards with BGA and complex SMD

With the advent of the BGA, there are no visible external terminals "visible to the eye" searching for short circuits or missing soldering.
The terminals of the BGA are made of small BALL of tin wich, melting during the welding process, stick to the PAD on the PCB board, ensuring the connection to the track that carries the signals outside the chip itself.
How to check if all the welds are Ok and and there are no short circuits without using the "X-rays?

Optical Inspection Station ErsaScope.
To succeed in doing so we bought an optical inspection station where, through a micro-camera and a fiber-optic lighting is possibole to display on a screen the channels between the PCB and the BGA checking in this way all the welds.

Vision of the micro-camera and lighting to see under the BGA
Fiber optic lighting on optical inspection station ErsaScope
In order to do this you need only to have an area of 2mm around the component in order to pass with the head of the camera.
By changing the focus, you can check the most internal channel and therefore to make a complete verification of all welds.

For all the images shown you can get the measures and capture snapshots as well as insert comments to have some documentation for the problems encountered.

Short circuit between 2 ball of the BGA

Waste of tin between 2 of the BGA ball

Another waste of tin between 2 of the BGA ball

The optical inspection is used not only for the BGA... As you can see can help you to find broken welds on QFN components!

Wiew of interrupted welding on a component QFN step 0.5mm.


Contact us for any further information and availability.


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